The Abrasive Technology Academic Forum is organized by Chinese Committee of Abrasive Technology (CCAT). The topics of this forum cover the science and engineering fields of Advanced abrasive technology, Grinding wheel and abrasive grain technologies, Superhard materials and its products, Abrasive machining technology, Abrasive jet machining, High speed and high-efficiency grinding, Micro/nano-machining, Ultrasonic machining and nontraditional machining, Brittle material machining, CMP and semiconductor wafer processing, Design, fabrication and analysis of devices for the applications of abrasive technologies, In-process measurement and monitoring, metrology of abrasive processing, Surface integrity and materials characterization, Robotic abrasive machining, Coolants and cooling, Truing, dressing, and ELID. Its main purposes are attending to guiding the advanced development in the field of abrasive technology research, exchanging the new theories & technology & methods and new progress in the field of the modern abrasive engineering. It provides its members a floor to discuss and exchange ideas of the abrasive technology research and engineering applications with each other, and also promotes and facilitates scientific and engineering innovation and development in the frontiers of manufacturing science and engineering application of abrasive technology.

Special forum person in charge and member information